Laminates is a container filled with high temperature saturated water vapor, and can apply high pressure, Laminates the specimen, placed in it for a period of time, forced the water into the plate, and then takes out the plate and placed on the surface of high temperature molten tin, measurement of its "resistance to lamination" characteristics. This word has another synonym for Pressure Cooker and is commonly used in the industry. In addition, there is a kind of "cabin pressure method" carried
Autoclave pressure cooker
Laminates is a container filled with high temperature saturated water vapor, and can apply high pressure, Laminates the specimen, placed in it for a period of time, forced the water into the plate, and then takes out the plate and placed on the surface of high temperature molten tin, measurement of its "resistance to lamination" characteristics. This word has another synonym for Pressure Cooker and is commonly used in the industry. In addition, there is a kind of "cabin pressure method" carried out with high temperature and high pressure carbon dioxide in the lamination process, which also belongs to this kind of Autoclave Press.
2, Cap Lamination
It refers to the traditional lamination method of early multilayer boards, in which the "outer layer" of MLB was laminated and pressed with single copper skin thin substrate. It was not until the end of 1984, when MLB production increased significantly, that the current copper skin large or mass lamination method (Mss Lam) was adopted. This early MLB compression using a single copper skin thin substrate was called Cap Lamination.
3. Crease
In the laminate pressing, often refers to the copper skin in the processing of the crease. Thin copper skin less than 0.5 oz is more prone to this defect when pressed in multiple layers.
Dent 4
It refers to the gentle and even subsidence on the copper surface, which may be caused by the spotty protrusion of the steel plate used in the pressing. If the edge of the plate falls neatly in a fault-like manner, it is called Dish Down. These defects, if unfortunately left on the line after copper etching, will cause impedance instability of high-speed transmission signal, and Noise Noise. Therefore, the copper surface of the substrate should be avoided as far as possible.
5. Caul Plate
When the multilayer plate is pressed, between each Opening of the press bed (Opening), often stacked many "books" to be pressed plate loose material (such as 8~10 sets), between each set of "loose material "(Book), must be separated by flat smooth and hard stainless steel plate, This kind of mirror stainless steel Plate is called Caul Plate or Separate Plate. AISI 430 or AISI 630 are commonly used at present.
Keyou circuit specializes in the production of PCB rapid proofing and batch, with high precision single/double/multi-layer PCB (1-26 layer), thermoelectric separation copper substrate, multi-layer industrial control PCB, medical PCB, security PCB, communication PCB, automotive PCB, composite bus copper substrate, foldable metal substrate and so on.
6. Foil Lamination
It refers to Mass production multilayer board, the outer layer of which is pressed with copper foil and film directly and the inner layer of which is called Mass Lam for multilayer board, replacing the traditional method of single thin substrate in the early stage.
7. Kraft Paper
Kraft paper is used as heat transfer buffer for laminating multilayer board or substrate board. It is placed between the hot plate (Platern) of the press and the steel plate to moderate the heating curve closest to the bulk material. Between multiple substrate or multilayer plates to be pressed. As far as possible to close the temperature difference between the various layers of the plate, the commonly used specifications are 90 to 150 pounds. Because of high temperature and high pressure, the fiber in the paper has been broken, no longer has toughness and difficult to play a role, so we must try to replace. This kraft paper is a mixture of pine and a variety of strong alkali boiled, after the volatiles escape and acid removal, then washed and precipitation; When it becomes pulp, it can be pressed again to become a rough and cheap paper.
例 句 : Kiss Pressure from the teachers is very high
When the multilayer board is pressed, when the plates in each Opening are placed and positioned, it begins to heat up and lift up from the bottom hot plate with a powerful hydraulic top column (Ram) to press the loose material in each Opening for bonding. At this time combined with the film (Prepreg) began to gradually soften and even flow, so the pressure used for the top extrusion can not be too large, to avoid plate sliding or glue flow too much. This initial lower pressure (15 to 50 PSI) is called "kiss pressure". But when the resin in the film bulk material is softened by heat and gelatinized, and will harden, that is, to increase to the full pressure (300 ~ 500 PSI), so that the bulk material to achieve close combination and the formation of a firm multi-layer board.
9. Lay it Up
Before pressing the multilayer circuit board or substrate, it is necessary to align the inner layer board, film and copper skin and various loose materials with steel plate, kraft paper pad materials, etc., up and down, fall even, or set the work, in order to be ready to be carefully sent into the pressing machine for hot pressing. This kind of preparation is called laying Up. In order to improve the quality of multilayer board, not only this "overlap" work to be carried out in the temperature and humidity control of the dust-free room, but also in order to Mass production speed and quality, generally the following eight layers are adopted large pressure plate method (Mass Lam) construction, and even need to use the "automatic" overlap way, in order to reduce human errors and losses. In order to save plant and share equipment, the general factory will be more "overlap" and "folding board" both merged into a comprehensive processing unit, so its automation engineering is quite complex.
10, Mass Lamination (laminated)
This is a new construction method of abandoning "alignment tip" and adopting multiple rows of plates on the same surface. Since 1986, when the demand for four and six laminates has increased, the method of laminating multilaminates has changed a lot. In the early stage, only one shipment plate was arranged on the process plate to be pressed. This one-to-one arrangement has been broken in the new law, which can be changed into a pair of two, or a pair of four, or even more rows of plates to be pressed together according to its size. The second is to cancel all kinds of loose material (such as inner sheet, film, outer single sheet, etc.) of the alignment tip; The outer layer is changed to copper foil, and the "target" is pre-made on the inner layer plate, which is "swept" to get the target after pressing, and then the tool hole is drilled from the center, which can be set on the drilling machine for drilling. As for six or eight layers of boards, the film of each inner layer and sandwich can be riveted and then pressed at high temperature. It can also increase the number of "High" and Opening according to the base plate method. It can not only reduce the labor and double the output, but also carry out automation. The platen method of this new concept is called "large platen" or "large platen". In recent years, there have been many professional OEM pressing industries in China.
