After three times of high temperature welding, it can be seen that the solder joint of the heavy metal plate card is full and bright and has no effect on the activity of solder paste and flux, while the solder joint of the OSP process is dark and shiny, which affects the activity of solder paste and flux, and is easy to cause empty welding and increase in repair
1. Welding strength comparison:
Sunken gold circuit board after three high temperature solder joint full, bright
OSP plate after three times of high temperature solder joint is dark, similar to the color of oxidation
After three times of high temperature welding, it can be seen that the solder joint of the heavy metal plate card is full and bright and has no effect on the activity of solder paste and flux, while the solder joint of the OSP process is dark and shiny, which affects the activity of solder paste and flux, and is easy to cause empty welding and increase in repair
Comparisoof heat dissipation:
The thermal conductivity of gold is good, and the pads do the best heat dissipation because of their good thermal conductivity. Good heat dissipation board temperature is low, chip work is more stable. The gold-plated plate has good heat dissipation. It can use comprehensive heat dissipation holes in the BEARING area of the CPU on the Notebook board and the welding base of BGA type components, while the heat dissipation of OSP and silver plate is average.
3. Comparison of electrical detectability:
The gold plate can be measured directly before and after production and shipment, the operation technology is simple, not affected by other conditions; OSP board because the surface layer is organic solderable film, and organic solderable film is non-conductive film, so it can not be directly measured, must be measured in front of OSP, but OSP is prone to micro-erosion excessive worry, resulting in poor welding; The surface of the silver plate is a skin film with general stability and strict requirements for the external environment.
4. Process difficulty and cost comparison:
The process of gold sink board is complicated, requiring high equipment and strict environmental protection, and the cost is the highest in the lead-free board due to the large amount of gold element. Silver card process is slightly less difficult, water quality and environmental requirements are quite strict, the cost is slightly lower than the gold plate; OSP board is the easiest to process, so the cost is the lowest.
Keyou circuit specializes in manufacturing high-precision double-sided/multi-layer circuit boards, thermoelectric separation single-sided/double-sided copper substrate, foldable metal substrate, busbar copper substrate, industrial control circuit boards, medical circuit boards, security PCB boards, communication PCB boards, automotive circuit boards, instrumentation circuit boards, military circuit boards.
